Used Mini reflow reflow principle _ _ Used Mini in Xintai equipment (certified merchants) are provided by Shenzhen Xintai Electronic Equipment Co., Ltd .. Shenzhen Xintai Electronic Equipment Co., Ltd. (www.szzxtsmt.com) is a specialist in the "medium and small reflow SMT production equipment research and development, production, sales and service," the company. Since its inception, we adhere to the "honesty, sound management" approach, the courage to participate in healthy competition in the market, so that "in Xintai Electronic Equipment" brand has a good reputation. We adhere to the "service first, customers first" principle, so in Xintai electronic devices has won the public's trust of customers in the electronics, electrical products, manufacturing equipment, and establish a good corporate image. Special Note: This information is for reference pictures and information, please contact us to obtain the most accurate information, thank you! In Xintai ZT-8030 mini sixteen temperature hot air reflow oven reflow oven parameter settings to get a temperature curve should first give the oven a parameter setting. Reflow oven parameter settings generally referred Recipe. Recipe generally include each district to set the oven temperature, conveyor belt speed settings, as well as the use of air or nitrogen. Factors to consider setting a reflow profile There are many used mini reflow, generally include: Paste feature is used, the characteristics of the PCB, and other characteristics of the oven. Discussed separately below. 2.2.2 solder reflow profiles of important features and characteristics determine the relationship paste reflow profiles basic features. Because different solder flux (Flux) has a different chemical composition, the chemical changes so that it has different temperature requirements for reflux temperature curve has different requirements. Usually paste suppliers can provide a reference reflow profile, the user can optimize their products on the basis of characteristics. Figure 11 is a typical Sn63 / Pb37 solder temperature reflow profile [6] (P3-7). In this diagram, for example, to analyze the hot air reflow curve. It can be divided into four main phases: 1) Put the PCB is heated to about 150 ℃, rising slope of 1-3 ℃ / sec. Said preheating (Preheat) Phase; 2) the entire board is heated slowly to 183 ℃. Said soaking (Soak or Equilibrium) stage. Time is usually 60-90 seconds. 3) The board is heated to the melting zone (183 ℃ above), the solder melts. Said reflux (Reflow Spike) stage. In the reflux stage of the board to reach the maximum temperature, typically 215 ℃ +/- 10 ℃. Preferably under reflux time 45-60 seconds, to a maximum of 90 seconds. 4) curve at the highest temperature point drop process. Said cooling (Cooling) stage. General requirements for cooling slope 2 -4 ℃ / sec. The main features of small reflow machine 1. Working voltage 220VAC. Volume: 600 × 450 × 500 2. dual-panel assembly can be completed without dispensing process. Used Mini Reflow soldering work 3.PCB line stationary state, with a viewing window used mini reflow price, easy to observe the welding process. 4. devices with RS232 communication interface and communication software. Computer storage by reflow soldering profile. 5. sliding drawer desk jobs, welding area 400 * 350 * 35MM, with high temperature ceramic support board. 6. The use of fuzzy control technology, with a blue backlit LCD screen, and the temperature curve to achieve set temperature parameters of the dynamic display. Three sets of parameters to determine the reflow soldering curve, the temperature range 0-300 ℃ can achieve lead-free solder. In patch welding, the current placement for high-volume automated welding equipment commonly used in some big company's product line. Such equipment is characterized by a high degree of automation Cheap Used Mini reflow processing large volume requirements, equipment prices high. In small batch processing or research and development process, such devices have been unable to meet the requirements.