In Xintai electronic equipment (Figure), used mini reflow soldering machines, used mini reflow provided by Shenzhen Xintai Electronic Equipment Co., Ltd .. Shenzhen Xintai Electronic Equipment Co., Ltd. (www.szzxtsmt.com) is a specialist in the "medium and small reflow SMT production equipment research and development, production, sales and service," the company. Since its inception, we adhere to the "honesty, sound management" approach, the courage to participate in healthy competition in the market, so that "in Xintai Electronic Equipment" brand has a good reputation. We adhere to the "service first, customers first" principle, so in Xintai electronic devices has won the public's trust of customers in the electronics, electrical products, manufacturing equipment, and establish a good corporate image. Special Note: This information is for reference pictures and information, please contact us to obtain the most accurate information, thank you! Xintai ZT-8030 medium in the basic principles of sixteen temperature hot air reflow Reflow is relatively simple, it first on the PCB surface mount components (SMD) pad printing paste, and then put through the automatic SMD placement machine pre-printed stickers put on a good solder pads. Finally, by reflow soldering reflow oven Cheap Used Mini, in a hot air reflow oven heated gradually wholesale used mini reflow, the solder melts, called reflux (Reflow), then put the PCB cooling, solder solidification, the element and the pad firmly welded together. In hot air reflow, pin pads and components do not melt. This is a hot air reflow (Reflow Soldering) Unlike metal melt welding (Welding) is. Depth understanding of physical and chemical changes must occur Reflow from the action principle and paste the welding process to start. Powder and flux paste composed mainly of tin-lead alloy mixture. Under conditions of heat, melt the solder material tin atoms and the pad or welded components (main ingredient is copper atoms) contact interface atomic interdiffusion Used Mini reflow to form intermetallic compound (IMC), first formed Cu6Sn5 , said n-phase, it is key to the connection layer forming a weld force, only the formation of the n-phase, it indicates there is a real and reliable welding. Over time, between the n-phase and the copper layer will continue to generate hot air reflow soldering machine details type hot air reflow soldering machine brand ZXT maximum effective size of 400 (mm) Model ZT-7040 Product Alias ??materials and lead-free reflow Current AC uses solder attachment plates role of the object heating radiator 1. Wait time: ≤ 15MIN ~ 20MIN 2. The maximum substrate size: 400mm × L (limited) 3. Temperature adjustment range: room temperature ~ 350 ℃ 4. furnace halls temperature difference: ≤ ± 2 ℃ 5. Speed ??adjustment range: 0 ~ 1800mm / MIN 6. Power supply: AC380V 50HZ (three-phase four-wire system) 7. Total power: 31KW 8. Dimensions: 4000mm × 900mm × 1350mm 9. Weight: 750Kg 10. Heating zone length: 2800mm